![]() Molex’s Micro-Fit BMI connectors are designed for hard to reach applications where it is not feasible for the connectors to be seen while engaging/disengaging, such as in a drawer or fan assembly tray and to permit self-alignment of the connectors, eliminating the need for direct line of sight, and assuring a good interface. Micro-Fit BMI connectors allow mating misalignment up to 2.54mm (.100") with a maximum current rating of 5A, making these connectors ideal for wire-to-wire, wire-to-board and board-to-board blind-mating applications. All components are leadfree, RoHS compliant, halogen free and glow wire capable. Micro-Fit 3.0 interconnects are UL recognised, CSA approved and TUV licensed. The housings utilise positive-lock features to prevent accidental disconnects. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. Micro-Fit 3.0 connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Based on a 3mm centerline, Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Molex’s Micro-Fit 3.0 interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. The RMF contacts are available in 20 to 30 AWG.įor more information about the Micro-Fit 3.Micro-Fit 3.0 Connectors are a 3mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 8.5A to meet low- to mid-range power application needs. The pre-lubricated version can be mated up to 250 times and fits into Micro-Fit 3.0 standard housings. If applications are to be equipped with connectors that require lower insertion and withdrawal forces or tolerate frequent mating cycles for longer, the Micro-Fit 3.0 RMF contacts come into focus. ![]() The pinhole-like shape ensures a reliable connection. In conjunction with the Micro-Fit 3.0 receptacle, it is possible to convert printed circuit boards easily from solder to press-fit applications. The CPI specification of the Micro-Fit 3.0 connectors includes a spring-loaded press-fit pin interface while retaining all the features of the standard Micro-Fit 3.0 connector.They are available in single-row with integrated secondary locking and double-row. Molex Micro-Fit TPA connectors prevent interference with end products. It can only be closed when the contact is correctly positioned. A contact position assurance (TPA) feature reduces contact slippage by providing redundant locking.With Micro-Fit BMI (Blind Mate Interface), Molex provides blind-mateable cable-to-cable and cable-to-board connectors, with up to 2.54 mm tolerance to misalignment and self-alignment capability. This is time-consuming and can result in damage. Especially in hard-to-reach applications, such as slide-in units or fan trays, connections must be able to be closed and opened without or with limited visual contact.To meet the diverse requirements of OEMs, for example, the Micro-Fit family from Molex offers the right connectors: Fully insulated terminals protect against possible damage to the terminals during handling as well as mating and minimize the risk of short circuits due to debris. ![]()
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